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Back End Processor (BEP) Input/Output (I/O) Board
GE Healthcare
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Product Overview

The Back End Processor (BEP) Input/Output (I/O) Board in Ultrasound is used in LOGIQ E9 and other medical equipments as applicable. It is a kit which comprises of connectors, capacitors, inductors, resistors, IC’s, diodes, memory eeprom, LED’s, protection fuse, receiver flat panel display, transmitter, ferrite bead, IO card fab, screws, bracket-bep io board, locking post kit, gaskets, foam insulator and BEPIO boot prom software. The I/O board is inserted into the BEP frame. While removing, all the I/O cables should be disconnected at the top of the BEP. The product material offers corrosion resistant, high dielectric strength, moisture resistant and strength to weight ratio. It is manufactured using high precision techniques which helps to achieve a good surface finish as well as good product consistency.

Compatible Products



The LOGIQ* E9 is a versatile general imaging system that helps meet a wide variety of general imaging needs. As healthcare evolves and ultrasound exams become more in demand, you need the ability to adapt to the changing environment with an ultrasound system that gives you flexibility, ease of use, speed and reliability.

The LOGIQ E9 can help you:

Deliver extraordinary image quality on a broad spectrum of patient body types.
Visualize blood flow without the limitations of Doppler
Enhance your workflow.
Integrate real-time ultrasound with previously acquired CT, MR, PET, or ultrasound images.
Visually track your position during a scan.

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GE and GE Monogram are trademarks of General Electric Company. GE Healthcare, a division of General Electric Company